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Sn95,5Ag3,8Cu0,7 (SAC387)

Lead-free solder bar, mainly intended for wave soldering, selective soldering, and dip soldering in soldering machines.

  • Pb Free
  • Wave soldering
  • Selective soldering
  • Dipping soldering
  • Tinning
Sn95,5Ag3,8Cu0,7 (SAC387) solder bar

Product name: Sn95,5Ag3,8Cu0,7 (SAC387)
Alloy designation in accordance with ISO 9453: Sn95,5Ag3,8Cu0,7 (713)
Product type: solder bar

1. General characteristics

The lead-free solder alloy Sn95,5Ag3,8Cu0,7 is manufactured by Cynel-Unipress in the first smelting of tin, silver and copper. Its chemical composition complies with ISO 9453. The use of a continuous casting process ensures that the metal oxide formation in the solder alloy is minimized. As a result, the negative effect of the formation of dross in the soldering process has been significantly reduced. The product is designed for a wide range of industrial applications in electronics and electrical engineering where RoHS compliance is required. It can be sold on the consumer market and also used by private individuals outside professional applications.

2. Alloy composition and maximum impurity values [%]

Sn Pb Sb Bi Cu Au In Ag Al As Cd Fe Ni Zn
rest 0,0700 0,1000 0,1000 0,5000
:
0,9000
0,0500 0,1000 3,6000
:
4,0000
0,0010 0,0300 0,0020 0,0200 0,0100 0,0010

3. Physical characteristics

Melting point217 °C (eutectic alloy)
Density7,44 g/cm3
Electrical conductivity0,132 μΩ•m
Thermal conductivity60 W/m•K
Tensile strength600 kgf/cm2
Elongation at break16%
Hardness15 HB
Suggested operating temperatures250 - 265 °C (wave soldering)

4. Other information

Dimensions

20 x 20 x ~320 mm (square cross-section)

Product with other dimensions (e.g. 10 x 40 mm x 1 kg or 24 x 13 mm x 0,75 kg) can be made to individual order.

Average weight

950 g / pc

Packaging

Carton box contains about 19 kg of solder bars (20 pieces).

Expiry date

Unlimited under normal storage conditions.

Markings

Carton boxes marked with alloy, dimensions of product, weight and batch number.

Storage

Store at room temperature in a dry place out of reach of children.

Files to download:

Physical, mechanical and chemical properties available in the TDS (download above).

Processes

Find products by application

Reflow Soldering

Reflow Soldering

Soft soldering process used in the assembly of surface-mount devices (SMD) on printed circuit boards (PCB).
Manual Soldering & Repair

Manual Soldering & Repair

Minor assembly works which do not require professional equipment.
Wave Soldering

Wave Soldering

Professional soldering on printed circuit boards (PCB) using through-hole technology (THT).
Selective Soldering

Selective Soldering

Process of selectively soldering components that are exceptionally temperature-sensitive therefore cannot be soldered in a traditional way.
Dip Soldering

Dip Soldering

For cable tinning and small scale soldering.
Car Body Renovation

Car Body Renovation

For car body tinning, evening out and reconstruction before painting.
Rework

Rework

Minor SMD and THT reworks and general electronic equipment repairs.

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